Supports DIMM
Les supports de mémoire font partie des cartes de circuit imprimé et sont conçus pour une utilisation dans les ordinateurs personnels, les serveurs et les postes de travail. Le module est monté sur la carte de circuit à l'aide d'un connecteur de module. Les modules DIMM sont la forme de mémoire la plus courante dans l'informatique.
Que sont les modules DIMM ?
Les ...
Afficher 1-20 de 106 produits
Amphenol ICC
-
Cosse cylindrique à sertir
SODIMM
Right Angle
-
0.5A
-
Copper Alloy
Gold
-
-
200
0.6mm
-
-
Surface Mount
LCP
-
DDR
-
Surface Mount
Yes
-40°C
-
85°C
-
UL 94V-0
-
30mΩ
-
1.8V
-
DDR SODIMM
-
-
-
Amphenol ICC
-
Cosse cylindrique à sertir
SODIMM
Straight
-
-
-
Copper Alloy
Gold
-
-
200
0.6mm
-
-
Surface Mount
LCP
-
DDR2
-
Surface Mount
Yes
-55°C
3mm
85°C
-
UL 94V-0
-
-
-
50V
-
10116658
-
-
-
Amphenol ICC
-
Cosse cylindrique à sertir
DDR3
Vertical
-
-
-
Copper Alloy
Gold
-
-
240
1mm
-
-
Board
High Temperature Thermoplastic
-
DDR3
-
Through Hole
Yes
-55°C
5.7mm
85°C
-
RoHS Compliant
-
-
-
1.3V
-
10078239
-
-
-
Amphenol ICC
-
Cosse cylindrique à sertir
DDR3
Vertical
-
-
-
Copper Alloy
Gold
-
-
240
1mm
-
-
Through Hole
High Temperature Thermoplastic
-
DDR3
-
Through Hole
Yes
-55°C
3mm
85°C
-
JEDEC MO-269
-
-
-
1.5V
-
10081530
-
-
-
Amphenol ICC
-
Cosse cylindrique à sertir
DDR3
Vertical
-
-
-
Copper Alloy
Gold
-
-
240
1mm
-
-
Through Hole
High Temperature Thermoplastic
-
DDR3
-
Through Hole
Yes
-55°C
3mm
85°C
-
JEDEC MO-269
-
-
-
1.5V
-
10081530
-
-
-
Molex
-
Socket
MiniDIMM
Right Angle
Verrouillé
1A
-
Laiton bronze phosphore
Gold
-
-
244
0.6mm
-
-
Surface Mount
High Temperature Thermoplastic
-
-
-
Surface Mount
Yes
-55°C
-
85°C
-
CSA LR19980
-
-
-
30V
-
78001
-
-
-
Molex
-
Socket
MiniDIMM
Straight
Verrouillé
1A
-
Copper Alloy
Gold
-
-
244
0.60mm
-
-
Surface Mount
High Temperature Thermoplastic
-
DDR2
-
Surface Mount
Yes
-10°C
-
85°C
-
UL E29179
-
-
-
30V
-
78035
-
-
-
Molex
-
Socket
DDR3
Straight
Verrouillé
1A
-
Copper Alloy
Gold
-
-
244
0.60mm
-
-
Surface Mount
High Temperature Thermoplastic
-
DDR3
-
Surface Mount
Yes
-55°C
-
85°C
-
UL E29179
-
-
-
30V
-
78035
-
-
-
Molex
-
Socket
DIMM
Vertical
Verrouillé
0.75A
-
Copper Alloy
Gold
-
-
288
0.85mm
-
-
Press Fit
Résines polyamide (nylon) haute performance
-
DDR4
-
Press Fit
Yes
-55°C
1.58mm
85°C
-
CSA LR19980
-
-
-
29V
-
78731
-
-
-
Molex
-
Socket
DIMM
Vertical
Verrouillé
0.75A
-
Copper Alloy
Gold
-
-
288
0.85mm
-
-
Through Hole
Nylon
-
DDR4
-
Through Hole
Yes
-55°C
1.58mm
85°C
-
CSA LR19980
-
-
-
29V
-
78726
-
-
-
Molex
-
Socket
DIMM
Vertical
Verrouillé
0.75A
-
Copper Alloy
Gold
-
-
288
0.85mm
-
-
Through Hole
Nylon
-
DDR4
-
Through Hole
Yes
-55°C
1.58mm
85°C
-
CSA LR19980
-
-
-
29V
-
78726
-
-
-
Molex
-
Socket
DIMM
Vertical
Verrouillé
0.75A
-
Copper Alloy
Gold over Tin
-
-
288
0.85mm
-
-
Through Hole
Nylon
-
DDR4
-
Through Hole
Yes
-55°C
1.58mm
85°C
-
CSA LR19980
-
-
-
29V
-
78726
-
-
-
Molex
-
Socket
DIMM
Vertical
Verrouillé
0.75A
-
Copper Alloy
Gold
-
-
288
0.85mm
-
-
Through Hole
Nylon
-
DDR4
-
Through Hole
Yes
-55°C
1.58mm
85°C
-
CSA LR19980
-
-
-
29V
-
78726
-
-
-
Molex
-
Socket
DIMM
25 °
Verrouillé
1A
-
Copper Alloy
Gold
-
-
240
1mm
-
-
Through Hole
High Temperature Thermoplastic
-
DDR3
-
Through Hole
Yes
-55°C
-
85°C
-
IEC-62474
-
-
-
30V
-
78373
-
-
-
Molex
-
Socket
DIMM
Vertical
-
1A
-
Copper Alloy
Gold
-
-
240
1mm
-
-
Through Hole
Nylon
-
DDR3
-
Pin
Yes
-55°C
-
85°C
-
RoHS Compliant
-
-
-
30V
-
78315
-
-
-
Molex
-
Socket
DIMM
Vertical
Verrouillé
1A
-
Copper Alloy
Gold
-
-
240
1mm
-
-
Through Hole
Nylon
-
DDR3
-
Press Fit
Yes
-55°C
-
85°C
-
UL E29179
-
-
-
30V
-
78315
-
-
-
TE Connectivity
-
Cosse cylindrique à sertir
Memory Card
Right Angle
-
0.5A
-
Copper Alloy
Gold
-
-
260
0.5mm
-
-
Board
High Temperature Thermoplastic
-
DDR4
-
Surface Mount
Yes
-55°C
8.2mm
85°C
-
UL 94V-0
-
10mΩ
-
1.2V
-
DDR4 SODIMM
-
-
-
TE Connectivity
-
Cosse cylindrique à sertir
Memory Card
Right Angle
-
0.5A
-
Copper Alloy
Gold
-
-
260
0.5mm
-
-
Board
High Temperature Thermoplastic
-
DDR4
-
Surface Mount
Yes
-55°C
8.2mm
85°C
-
UL 94V-0
-
50mΩ
-
1.2V
-
DDR4 SODIMM
-
-
-
TE Connectivity
-
Cosse cylindrique à sertir
Memory Card
Right Angle
-
0.5A
-
Copper Alloy
Gold
-
-
260
0.5mm
-
-
Board
High Temperature Thermoplastic
-
DDR4
-
Surface Mount
Yes
-55°C
8.2mm
85°C
-
UL 94V-0
-
50mΩ
-
1.2V
-
DDR4 SODIMM
-
-
-
TE Connectivity
-
Socket
Memory Card
Straight
Cam-In
0.5A
-
Copper Alloy
Gold Flash
-
-
200
0.6mm
-
-
Board
High Temperature Thermoplastic
-
DDR
-
Surface Mount
-
-55°C
6.2mm
85°C
-
UL 94V-0
-
-
-
2.5V
-
DDR2 SO DIMM
-
-
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