Supports DIMM
Les supports de mémoire font partie des cartes de circuit imprimé et sont conçus pour une utilisation dans les ordinateurs personnels, les serveurs et les postes de travail. Le module est monté sur la carte de circuit à l'aide d'un connecteur de module. Les modules DIMM sont la forme de mémoire la plus courante dans l'informatique.
Que sont les modules DIMM ?
Les ...
Afficher 1-20 de 106 produits
Amphenol ICC
Cosse cylindrique à sertir
-
SODIMM
-
Right Angle
-
0.5A
Copper Alloy
Gold
-
200
-
0.6mm
-
Surface Mount
-
-
LCP
-
DDR
Surface Mount
-40°C
Yes
85°C
-
-
UL 94V-0
30mΩ
-
-
DDR SODIMM
-
-
-
-
1.8V
Amphenol ICC
Cosse cylindrique à sertir
-
SODIMM
-
Straight
-
-
Copper Alloy
Gold
-
200
-
0.6mm
-
Surface Mount
-
-
LCP
-
DDR2
Surface Mount
-55°C
Yes
85°C
-
3mm
UL 94V-0
-
-
-
10116658
-
-
-
-
50V
Amphenol ICC
Cosse cylindrique à sertir
-
DDR3
-
Vertical
-
-
Copper Alloy
Gold
-
240
-
1mm
-
Board
-
-
High Temperature Thermoplastic
-
DDR3
Through Hole
-55°C
Yes
85°C
-
5.7mm
RoHS Compliant
-
-
-
10078239
-
-
-
-
1.3V
Amphenol ICC
Cosse cylindrique à sertir
-
DDR3
-
Vertical
-
-
Copper Alloy
Gold
-
240
-
1mm
-
Through Hole
-
-
High Temperature Thermoplastic
-
DDR3
Through Hole
-55°C
Yes
85°C
-
3mm
JEDEC MO-269
-
-
-
10081530
-
-
-
-
1.5V
Amphenol ICC
Cosse cylindrique à sertir
-
DDR3
-
Vertical
-
-
Copper Alloy
Gold
-
240
-
1mm
-
Through Hole
-
-
High Temperature Thermoplastic
-
DDR3
Through Hole
-55°C
Yes
85°C
-
3mm
JEDEC MO-269
-
-
-
10081530
-
-
-
-
1.5V
Molex
Socket
-
MiniDIMM
Verrouillé
Right Angle
-
1A
Laiton bronze phosphore
Gold
-
244
-
0.6mm
-
Surface Mount
-
-
High Temperature Thermoplastic
-
-
Surface Mount
-55°C
Yes
85°C
-
-
CSA LR19980
-
-
-
78001
-
-
-
-
30V
Molex
Socket
-
MiniDIMM
Verrouillé
Straight
-
1A
Copper Alloy
Gold
-
244
-
0.60mm
-
Surface Mount
-
-
High Temperature Thermoplastic
-
DDR2
Surface Mount
-10°C
Yes
85°C
-
-
UL E29179
-
-
-
78035
-
-
-
-
30V
Molex
Socket
-
DDR3
Verrouillé
Straight
-
1A
Copper Alloy
Gold
-
244
-
0.60mm
-
Surface Mount
-
-
High Temperature Thermoplastic
-
DDR3
Surface Mount
-55°C
Yes
85°C
-
-
UL E29179
-
-
-
78035
-
-
-
-
30V
Molex
Socket
-
DIMM
Verrouillé
Vertical
-
0.75A
Copper Alloy
Gold
-
288
-
0.85mm
-
Press Fit
-
-
Résines polyamide (nylon) haute performance
-
DDR4
Press Fit
-55°C
Yes
85°C
-
1.58mm
CSA LR19980
-
-
-
78731
-
-
-
-
29V
Molex
Socket
-
DIMM
Verrouillé
Vertical
-
0.75A
Copper Alloy
Gold
-
288
-
0.85mm
-
Through Hole
-
-
Nylon
-
DDR4
Through Hole
-55°C
Yes
85°C
-
1.58mm
CSA LR19980
-
-
-
78726
-
-
-
-
29V
Molex
Socket
-
DIMM
Verrouillé
Vertical
-
0.75A
Copper Alloy
Gold
-
288
-
0.85mm
-
Through Hole
-
-
Nylon
-
DDR4
Through Hole
-55°C
Yes
85°C
-
1.58mm
CSA LR19980
-
-
-
78726
-
-
-
-
29V
Molex
Socket
-
DIMM
Verrouillé
Vertical
-
0.75A
Copper Alloy
Gold over Tin
-
288
-
0.85mm
-
Through Hole
-
-
Nylon
-
DDR4
Through Hole
-55°C
Yes
85°C
-
1.58mm
CSA LR19980
-
-
-
78726
-
-
-
-
29V
Molex
Socket
-
DIMM
Verrouillé
Vertical
-
0.75A
Copper Alloy
Gold
-
288
-
0.85mm
-
Through Hole
-
-
Nylon
-
DDR4
Through Hole
-55°C
Yes
85°C
-
1.58mm
CSA LR19980
-
-
-
78726
-
-
-
-
29V
Molex
Socket
-
DIMM
Verrouillé
25 °
-
1A
Copper Alloy
Gold
-
240
-
1mm
-
Through Hole
-
-
High Temperature Thermoplastic
-
DDR3
Through Hole
-55°C
Yes
85°C
-
-
IEC-62474
-
-
-
78373
-
-
-
-
30V
Molex
Socket
-
DIMM
-
Vertical
-
1A
Copper Alloy
Gold
-
240
-
1mm
-
Through Hole
-
-
Nylon
-
DDR3
Pin
-55°C
Yes
85°C
-
-
RoHS Compliant
-
-
-
78315
-
-
-
-
30V
Molex
Socket
-
DIMM
Verrouillé
Vertical
-
1A
Copper Alloy
Gold
-
240
-
1mm
-
Through Hole
-
-
Nylon
-
DDR3
Press Fit
-55°C
Yes
85°C
-
-
UL E29179
-
-
-
78315
-
-
-
-
30V
TE Connectivity
Cosse cylindrique à sertir
-
Memory Card
-
Right Angle
-
0.5A
Copper Alloy
Gold
-
260
-
0.5mm
-
Board
-
-
High Temperature Thermoplastic
-
DDR4
Surface Mount
-55°C
Yes
85°C
-
8.2mm
UL 94V-0
10mΩ
-
-
DDR4 SODIMM
-
-
-
-
1.2V
TE Connectivity
Cosse cylindrique à sertir
-
Memory Card
-
Right Angle
-
0.5A
Copper Alloy
Gold
-
260
-
0.5mm
-
Board
-
-
High Temperature Thermoplastic
-
DDR4
Surface Mount
-55°C
Yes
85°C
-
8.2mm
UL 94V-0
50mΩ
-
-
DDR4 SODIMM
-
-
-
-
1.2V
TE Connectivity
Cosse cylindrique à sertir
-
Memory Card
-
Right Angle
-
0.5A
Copper Alloy
Gold
-
260
-
0.5mm
-
Board
-
-
High Temperature Thermoplastic
-
DDR4
Surface Mount
-55°C
Yes
85°C
-
8.2mm
UL 94V-0
50mΩ
-
-
DDR4 SODIMM
-
-
-
-
1.2V
TE Connectivity
Socket
-
Memory Card
Cam-In
Straight
-
0.5A
Copper Alloy
Gold Flash
-
200
-
0.6mm
-
Board
-
-
High Temperature Thermoplastic
-
DDR
Surface Mount
-55°C
-
85°C
-
6.2mm
UL 94V-0
-
-
-
DDR2 SO DIMM
-
-
-
-
2.5V
















