Supports DIMM
Les supports de mémoire font partie des cartes de circuit imprimé et sont conçus pour une utilisation dans les ordinateurs personnels, les serveurs et les postes de travail. Le module est monté sur la carte de circuit à l'aide d'un connecteur de module. Les modules DIMM sont la forme de mémoire la plus courante dans l'informatique.
Que sont les modules DIMM ?
Les ...
Afficher 1-20 de 106 produits
Amphenol ICC
Cosse cylindrique à sertir
SODIMM
-
Right Angle
-
0.5A
-
Copper Alloy
-
Gold
-
200
-
0.6mm
-
Surface Mount
-
LCP
-
DDR
Surface Mount
-40°C
Yes
85°C
-
-
30mΩ
UL 94V-0
-
-
DDR SODIMM
1.8V
-
-
-
-
Amphenol ICC
Cosse cylindrique à sertir
SODIMM
-
Straight
-
-
-
Copper Alloy
-
Gold
-
200
-
0.6mm
-
Surface Mount
-
LCP
-
DDR2
Surface Mount
-55°C
Yes
85°C
-
3mm
-
UL 94V-0
-
-
10116658
50V
-
-
-
-
Amphenol ICC
Cosse cylindrique à sertir
DDR3
-
Vertical
-
-
-
Copper Alloy
-
Gold
-
240
-
1mm
-
Board
-
High Temperature Thermoplastic
-
DDR3
Through Hole
-55°C
Yes
85°C
-
5.7mm
-
RoHS Compliant
-
-
10078239
1.3V
-
-
-
-
Amphenol ICC
Cosse cylindrique à sertir
DDR3
-
Vertical
-
-
-
Copper Alloy
-
Gold
-
240
-
1mm
-
Through Hole
-
High Temperature Thermoplastic
-
DDR3
Through Hole
-55°C
Yes
85°C
-
3mm
-
JEDEC MO-269
-
-
10081530
1.5V
-
-
-
-
Amphenol ICC
Cosse cylindrique à sertir
DDR3
-
Vertical
-
-
-
Copper Alloy
-
Gold
-
240
-
1mm
-
Through Hole
-
High Temperature Thermoplastic
-
DDR3
Through Hole
-55°C
Yes
85°C
-
3mm
-
JEDEC MO-269
-
-
10081530
1.5V
-
-
-
-
Molex
Socket
MiniDIMM
-
Right Angle
Verrouillé
1A
-
Laiton bronze phosphore
-
Gold
-
244
-
0.6mm
-
Surface Mount
-
High Temperature Thermoplastic
-
-
Surface Mount
-55°C
Yes
85°C
-
-
-
CSA LR19980
-
-
78001
30V
-
-
-
-
Molex
Socket
MiniDIMM
-
Straight
Verrouillé
1A
-
Copper Alloy
-
Gold
-
244
-
0.60mm
-
Surface Mount
-
High Temperature Thermoplastic
-
DDR2
Surface Mount
-10°C
Yes
85°C
-
-
-
UL E29179
-
-
78035
30V
-
-
-
-
Molex
Socket
DDR3
-
Straight
Verrouillé
1A
-
Copper Alloy
-
Gold
-
244
-
0.60mm
-
Surface Mount
-
High Temperature Thermoplastic
-
DDR3
Surface Mount
-55°C
Yes
85°C
-
-
-
UL E29179
-
-
78035
30V
-
-
-
-
Molex
Socket
DIMM
-
Vertical
Verrouillé
0.75A
-
Copper Alloy
-
Gold
-
288
-
0.85mm
-
Press Fit
-
Résines polyamide (nylon) haute performance
-
DDR4
Press Fit
-55°C
Yes
85°C
-
1.58mm
-
CSA LR19980
-
-
78731
29V
-
-
-
-
Molex
Socket
DIMM
-
Vertical
Verrouillé
0.75A
-
Copper Alloy
-
Gold
-
288
-
0.85mm
-
Through Hole
-
Nylon
-
DDR4
Through Hole
-55°C
Yes
85°C
-
1.58mm
-
CSA LR19980
-
-
78726
29V
-
-
-
-
Molex
Socket
DIMM
-
Vertical
Verrouillé
0.75A
-
Copper Alloy
-
Gold
-
288
-
0.85mm
-
Through Hole
-
Nylon
-
DDR4
Through Hole
-55°C
Yes
85°C
-
1.58mm
-
CSA LR19980
-
-
78726
29V
-
-
-
-
Molex
Socket
DIMM
-
Vertical
Verrouillé
0.75A
-
Copper Alloy
-
Gold over Tin
-
288
-
0.85mm
-
Through Hole
-
Nylon
-
DDR4
Through Hole
-55°C
Yes
85°C
-
1.58mm
-
CSA LR19980
-
-
78726
29V
-
-
-
-
Molex
Socket
DIMM
-
Vertical
Verrouillé
0.75A
-
Copper Alloy
-
Gold
-
288
-
0.85mm
-
Through Hole
-
Nylon
-
DDR4
Through Hole
-55°C
Yes
85°C
-
1.58mm
-
CSA LR19980
-
-
78726
29V
-
-
-
-
Molex
Socket
DIMM
-
25 °
Verrouillé
1A
-
Copper Alloy
-
Gold
-
240
-
1mm
-
Through Hole
-
High Temperature Thermoplastic
-
DDR3
Through Hole
-55°C
Yes
85°C
-
-
-
IEC-62474
-
-
78373
30V
-
-
-
-
Molex
Socket
DIMM
-
Vertical
Verrouillé
1A
-
Copper Alloy
-
Gold
-
240
-
1mm
-
Through Hole
-
Nylon
-
DDR3
Press Fit
-55°C
Yes
85°C
-
-
-
UL E29179
-
-
78315
30V
-
-
-
-
Molex
Socket
DIMM
-
Vertical
-
1A
-
Copper Alloy
-
Gold
-
240
-
1mm
-
Through Hole
-
Nylon
-
DDR3
Pin
-55°C
Yes
85°C
-
-
-
RoHS Compliant
-
-
78315
30V
-
-
-
-
TE Connectivity
Cosse cylindrique à sertir
Memory Card
-
Right Angle
-
0.5A
-
Copper Alloy
-
Gold
-
260
-
0.5mm
-
Board
-
High Temperature Thermoplastic
-
DDR4
Surface Mount
-55°C
Yes
85°C
-
8.2mm
10mΩ
UL 94V-0
-
-
DDR4 SODIMM
1.2V
-
-
-
-
TE Connectivity
Cosse cylindrique à sertir
Memory Card
-
Right Angle
-
0.5A
-
Copper Alloy
-
Gold
-
260
-
0.5mm
-
Board
-
High Temperature Thermoplastic
-
DDR4
Surface Mount
-55°C
Yes
85°C
-
8.2mm
50mΩ
UL 94V-0
-
-
DDR4 SODIMM
1.2V
-
-
-
-
TE Connectivity
Cosse cylindrique à sertir
Memory Card
-
Right Angle
-
0.5A
-
Copper Alloy
-
Gold
-
260
-
0.5mm
-
Board
-
High Temperature Thermoplastic
-
DDR4
Surface Mount
-55°C
Yes
85°C
-
8.2mm
50mΩ
UL 94V-0
-
-
DDR4 SODIMM
1.2V
-
-
-
-
TE Connectivity
Socket
Memory Card
-
Straight
Cam-In
0.5A
-
Copper Alloy
-
Gold Flash
-
200
-
0.6mm
-
Board
-
High Temperature Thermoplastic
-
DDR
Surface Mount
-55°C
-
85°C
-
6.2mm
-
UL 94V-0
-
-
DDR2 SO DIMM
2.5V
-
-
-
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