Pâte souder ss Pb, faible Ag, tube 500 g
Documents techniques
Spécifications
Détails du produit
OM-350(low Silver) Lead Free Solder Paste
Lead free, no-clean solder paste suitable for fine feature screen printing and reflow using the most demanding soak reflow profiles in air or nitrogen atmospheres. The outstanding reflow process window delivers good soldering on all popular lead free surface finishes. Compliance with Bellcore & JIS reliability testing as well as IPC Class III voiding classifications ensures maximum long-term product reliability.
Standards
ROL0 Designation to ANSI/J-STD-004
Solder Paste - Lead Free
Prix sur demande
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Prix sur demande
1
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Documents techniques
Spécifications
Détails du produit
OM-350(low Silver) Lead Free Solder Paste
Lead free, no-clean solder paste suitable for fine feature screen printing and reflow using the most demanding soak reflow profiles in air or nitrogen atmospheres. The outstanding reflow process window delivers good soldering on all popular lead free surface finishes. Compliance with Bellcore & JIS reliability testing as well as IPC Class III voiding classifications ensures maximum long-term product reliability.
Standards
ROL0 Designation to ANSI/J-STD-004
Solder Paste - Lead Free