Documents techniques
Spécifications
Brand
MurataCapacité
470nF
Tension
25V dc
Boîtier
0805
Type de montage
Surface Mount
Diélectrique
R*1
Tolérance
±10%
Dimensions
2 x 1.25 x 0.85mm
Longueur
2mm
Profondeur
1.25mm
Taille
0.85mm
Série
GRM
Température de fonctionnement maximum
+125°C
Température d'utilisation minimum
-55°C
Type de borne
Surface Mount
Détails du produit
Diélectrique Murata GRM 0805 R
0805 Range
Nickel barrier terminations covered with a layer of plated Tin (NiSn). Applications include mobile phones, video and tuner designs, COG/NPO is the most popular formulation of the "temperature compensating", EIA Class I ceramic materials, X7R, X5R formulations are called "temperature stable" ceramics and fall into the EIA Class II materials, Y5V, Z5U formulations are for general purpose use in a limited temperature range, EIA Class II materials; these characteristics are ideal for decoupling applications.
Les informations sur le stock sont temporairement indisponibles.
Prix sur demande
Each (In a Pack of 50) (hors TVA)
50
Prix sur demande
Each (In a Pack of 50) (hors TVA)
Les informations sur le stock sont temporairement indisponibles.
50
Documents techniques
Spécifications
Brand
MurataCapacité
470nF
Tension
25V dc
Boîtier
0805
Type de montage
Surface Mount
Diélectrique
R*1
Tolérance
±10%
Dimensions
2 x 1.25 x 0.85mm
Longueur
2mm
Profondeur
1.25mm
Taille
0.85mm
Série
GRM
Température de fonctionnement maximum
+125°C
Température d'utilisation minimum
-55°C
Type de borne
Surface Mount
Détails du produit
Diélectrique Murata GRM 0805 R
0805 Range
Nickel barrier terminations covered with a layer of plated Tin (NiSn). Applications include mobile phones, video and tuner designs, COG/NPO is the most popular formulation of the "temperature compensating", EIA Class I ceramic materials, X7R, X5R formulations are called "temperature stable" ceramics and fall into the EIA Class II materials, Y5V, Z5U formulations are for general purpose use in a limited temperature range, EIA Class II materials; these characteristics are ideal for decoupling applications.
